ATE can be used to package components (typically IC "chips") or directly to silicon wafers. Packaged parts use processors to place devices on custom interface boards, while silicon wafers are tested directly using high-precision probes. The ATE system interfaces with a processor or probe to test the

The CMM is guided by air bearings, so that there is no friction and wear between the guide rails, and long-term performance uniformity can be maintained. The high-pressure gas enters between the working surface and the guide surface through the small air holes in the air bearing, forming a uniform air gap. The normal working air gap of the air bearing is between 3 and 10 μm.